-40%
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook

10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook

$ 41.71

Availability: 15 in stock
  • Form Factor: NVME SSD
  • California Prop 65 Warning: None
  • Item must be returned within: 30 Days
  • Type: Passive SSD Cooler
  • Compatible Brand: For Acer
  • Modified Item: No
  • Packaging: None
  • MPN: Does Not Apply
  • Brand: SOARINGDRAGON
  • Country/Region of Manufacture: China
  • Return shipping will be paid by: Buyer
  • Fan Diameter: None
  • Refund will be given as: Money Back
  • Restocking Fee: No
  • Power Connection: None
  • To Fit: Nvme SSD
  • Custom Bundle: No
  • All returns accepted: Returns Accepted
  • Maximum Fan Speed: None
  • Condition: New
  • Maximum Airflow Volume: None
  • Model: 2280cu
  • Non-Domestic Product: No
  • Fan Light Color: Black
  • Material: Copper
  • Voltage: None
  • Color: Black
  • Bearing Type: None

    Description

    10/Lot M.2 NVME NGFF 2280 SSD Copper Heatsink Radiation Fin for Laptop Notebook
    Compatible: M.2 NGFF PCI-E NVMe 2280 SSD
    Color: Black
    Material:
    Anaerobic copper
    Heat sink with 5°C- 15°C cooling effect.
    1. Disassembly and assembly do not require accessories or tools;
    2. Strong heat dissipation in a large area with almost comprehensive coverage;
    3. Suitable for most laptops and small installation scenarios.
    4.
    Heat dissipation coefficient: TU1 3.91W/mK thermal power consumption (TDP): 8W
    5.
    Thermal conductive silicone pad: Laird/Laird TFLEX 530,
    Heat conductivity: 2.8W/mK
    Pls forgive that if any change of products will not make additional specify in advance.
    Package Included: (Heatsink only, not include M.2 SSD)
    10X Heatsink with
    Laird TFLEX530 Thermal Pad