-40%
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC

M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC

$ 4.74

Availability: 128 in stock
  • Fan Diameter: None
  • Packaging: None
  • All returns accepted: Returns Accepted
  • Material: Copper
  • Brand: SOARINGDRAGON
  • Country/Region of Manufacture: China
  • Compatible Brand: For Acer
  • Type: Passive SSD Cooler
  • Bearing Type: None
  • Condition: New
  • Return shipping will be paid by: Buyer
  • Fan Light Color: Black
  • Maximum Airflow Volume: None
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Custom Bundle: No
  • Non-Domestic Product: No
  • To Fit: Nvme SSD
  • Color: Black
  • Maximum Fan Speed: None
  • Form Factor: NVME SSD
  • Restocking Fee: No
  • Modified Item: No
  • Model: 2280cu
  • Power Connection: None
  • California Prop 65 Warning: None
  • Voltage: None
  • MPN: Does Not Apply

    Description

    M.2 NVME NGFF 2280 SSD COOLING HEATSINK RADIATION FIN FOR LAPTOP NOTEBOOK PC NEW
    Compatible: M.2 NGFF PCI-E NVMe 2280 SSD
    Color: Black
    Material:
    Anaerobic copper
    Heat sink with 5°C- 15°C cooling effect.
    1. Disassembly and assembly do not require accessories or tools;
    2. Strong heat dissipation in a large area with almost comprehensive coverage;
    3. Suitable for most laptops and small installation scenarios.
    4.
    Heat dissipation coefficient: TU1 3.91W/mK thermal power consumption (TDP): 8W
    5.
    Thermal conductive silicone pad: Laird/Laird TFLEX 530,
    Heat conductivity: 2.8W/mK
    Pls forgive that if any change of products will not make additional specify in advance.
    Package Included: (Heatsink only, not include M.2 SSD)
    1X Heatsink
    1X Laird TFLEX530 Thermal Pad